Interdigital Mobile Edge Computing Proof of Concept Accepted by ETSI

'FLIPS-Flexible IP-based Services' proposal submitted


InterDigital, Inc., a mobile technology research and development company, today announced that ETSI’s Industry Specification Group for Mobile Edge Computing (ISG MEC) officially accepted the proposal submitted by the company and four other collaborators titled “FLIPS – Flexible IP-based Services.” The proof-of-concept is the fourth accepted by the ETSI group, joining proofs-of-concept by China Mobile, Intel, Nokia and Telecom Italia.

The proof-of-concept, FLIPS – Flexible IP-based Services, is an operator-based MEC application designed to accelerate delivery of IP-based content and streaming media. FLIPS reinvents the approach to IP-based services through the introduction of a software-defined networking (SDN) and network function virtualization (NFV) enabled network fabric.

FLIPS – Flexible IP-based Services was proposed by a team that consists of InterDigital, Bristol is Open, Intracom, CVTC and University of Essex. The world’s first IP-over-ICN-over-SDN implementation was demonstrated by the proof-of-concept team as a labs test of FLIPS on a significantly smaller scale in July 2015 within the EU-funded collaborative research and development action titled POINT (“IP Over ICN – the Better IP”). InterDigital has been driving the development of the flexible service routing platform that underpins the proof-of-concept.

MEC is expected to enable the transition to 5G and is considered a key enabler for Internet of Things. ISG MEC’s proofs-of-concept aim to demonstrate MEC as a viable technology and are developed according to the ETSI ISG MEC Proof-of-Concept Framework. The proofs-of-concept will be evaluated against key performance parameters for consideration in standard forums such as ETSI and IETF.

FLIPS – Flexible IP-based Services as a ETSI MEC proof-of-concept will be demonstrated three times throughout 2016. The first large scale demonstration will take place at InterDigital’s booth located in Hall 7 Booth 7A71 during Mobile World Congress 2016 in Barcelona, Spain.

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